Mihai-George Mureșan serves as Team Leader for Laser-Induced Damage Threshold (LIDT) Determination and Coordinator for Laser Applications on Semiconductor Materials at the HiLASE Centre, part of the Institute of Physics of the Czech Academy of Sciences. In this role, he oversees the design and execution of experiments, selects and optimizes laser processes, and drives the development of novel laser-based methods for semiconductors.
He earned his doctorate in Plasma Physics from the Faculty of Science, Masaryk University, in 2015, with a dissertation on Plasma-Enhanced CVD of Multicomponent Functional Coatings. Prior to that, he completed an M.Sc. in Applied Technical Sciences with a focus on Condensed Matter Physics at Ovidius University of Constanța in 2009. During his studies, he expanded his expertise through research stays at Institut Fresnel (France), the Science and Technology Facilities Council (UK), and the Center for Physical Sciences and Technology (Lithuania).
Since joining the HiLASE Centre in 2010 as a laboratory assistant and doctoral researcher, Mihai has progressed through roles as Vacuum Engineer (2013–2015) and Research Scientist specializing in laser damage thresholds (2015–2025), before assuming his current leadership position in 2025. His work bridges fundamental research and practical applications, maintaining shared-beam infrastructure and coordinating cross-disciplinary teams.
Mihai’s technical expertise spans applied research on laser–matter interactions in optical and semiconductor materials, LIDT testing in bulk optics, thin films, and fibers, as well as analytical techniques such as confocal microscopy and Raman spectroscopy. He is responsible for translating research into robust processes that meet industry-grade reliability requirements.
Recognized for his ability to link cutting-edge laser research with industrial needs, Mihai actively fosters collaboration between academia and industry. As a mentor and coordinator, he supports emerging researchers in mastering both the scientific and process-engineering aspects of laser technology for semiconductor processing.
